For you we find customized solutions for non-contact optical inspection of wafers, probe cards, dies and microchip components. For this purpose, we offer systems for layer thickness measurement, contact inspection, electrical characterization, probe head positioning, sample manipulation and metrology of wafer microstructures in the nanometer range.
Individual customization and development of your Innovaiton
- Optimal positioning solution for your application with a fast and free 3D design
- Design of functional samples, prototypes up to series production
- Integrated development of your mechanics, electronics and software
Series production of your innovation on > 3.900 m² production area
more about the technical specifications