Wafer and chip inspection / measurement

For you we find customized solutions for non-contact optical inspection of wafers, probe cards, dies and microchip components. For this purpose, we offer systems for layer thickness measurement, contact inspection, electrical characterization, probe head positioning, sample manipulation and metrology of wafer microstructures in the nanometer range.

Custom Positioning Systems

Multi Axes Systems

Standard Axes & Stages

Vacuum / Clean Room

Ball & Lead Screw Drives