X-Rz-Z-Ry Positioning System for Wafer Inspection up to 12 inch / 300 mm (Cleanroom ISO 6) | Travel 200 mm × n×360° × 100 mm × 60°
Inspection and Mikroscopy

Art. ID 237790.oem

The X-Rz-Z-Ry positioning system is designed for high-precision inspection of 300 mm wafers in cleanroom environments up to ISO Class 6 (better on request). Wafers / chucks are positioned on a combined air bearing rotary and linear system and guided relative to the inspection optics using defined linear, rotational, and tilting motions. The system architecture enables fast scanning motions for high throughput and extremely stable standstill positions for sub-micrometer-accurate measurements - ideal for demanding inspection and metrology processes in semiconductor manufacturing.

High-stiffness inspection with high throughput

Designed for wafers up to 12 inch / 300 mm with highly stable air bearing motion

Combined X, Rz, Z, and Ry motion for scanning, rotation, and oblique viewing within a single system

Very high stiffness combined with high resolution for reproducible measurement and inspection points

Nanometer-level standstill stability for optical, interferometric, and sensor-based measurement methods

Dynamic drives (linear motor / torque motor) for high throughput in automated inspection workflows

Maintenance-free operation in 24/7 use

Options:

Configuration tailored to the customer-specific wafer inspection process (optics, sensors, scan strategy)
Higher cleanroom classes than ISO 6 (on request)
Individual wafer holders, chucks, and process head mounts
High-resolution measurement systems for linear and rotational axes
Enclosures, frames, and safety concepts for use in FAB environments

Application Fields

Automated wafer inspection up to 300 mm, defect and surface inspection, optical metrology in semiconductor manufacturing, structure and overlay measurements, edge inspection, inspection systems for front-end and back-end processes, inline and offline inspection tools, research and development in semiconductor and microsystems technology

Specifications

Art. ID 237790.oem		X	Rz	Z	Ry
Standard system		LA165	DT350	PMT160	DT130
Travel	[mm; deg]	200	n x 360	100	± 60
Repeatability unidirectional	[µm; deg]	± 0.3	± 0.00018	± 0.3	± 1.2
Repeatability bidirectional	[µm; deg]	± 0.4	± 0.0003	± 0.4	± 1.9
Positioning speed	[mm/s; deg/s]	150	410	9	27
Max. speed	[mm/s; deg/s]	200	620	15	40
Max. acceleration	[m/s²; deg/s²]	1.1	8500	200	520
Max. load	[N]		22		15
Weight	[kg]	195
Length x width x height	[mm]	590 x 590 x 550 mm
Max. sample size		300 mm / 12 inch
Motor		Ironless linear motor, torque motor, DC motor
Drive		Ball screw, worm gear
Guide		Air bearing, cross roller bearing
Feedback		Linear scale, angular scale
Measuring system resolution		0.1 µm, optional up to 0.001 µm / none
Material		Anodized aluminum, granite
Optional features		Design tailored to the customer-specific inspection process, wafer holders, chucks, process head mounting, high-resolution measuring systems for linear and rotary axes, enclosure, frame, safety concepts for use in fab environments
Versions for Cleanroom		up to cleanroom class ISO 6 (better on request)
Beam variants		UV (DUV, EUV, X-ray, gamma on request)
Versions with Lower Magnetism		magnetic
Versions for Vacuum		-