XY-Rz Positioning System for M2 / 6" Wafer Inspection (Cleanroom ISO 6) | XY Linear Motor, Linear Scale | Phi AC Servo, Harmonic Drive | Travel 170 × 170 mm × 360°
Inspection and Mikroscopy

782460:001.26.oem

Precise Wafer Positioning with Vacuum Chuck

The positioning system moves the wafer via an XY platform with a KT305-EDLM linear stage and an integrated rotary unit (Phi axis). The wafer is fixed by a vacuum chuck and aligned at its edges using a light barrier system. Laser structuring and measurement are then performed.

Ideal for fast, automated processes with alignment completed in under one second per cycle

Two process variants:
– Alignment in the processing position (compact stage design)
– Alignment outside the processing position with an offset movement of approx. 180 mm for dust-free camera operation

High precision with ±0.4 µm in XY and 0.005° in Phi

Edge scanning via sensor with 2 mm measuring range, four scans of 2 seconds each

Total alignment and transfer cycle time: < 15 s/wafer (M2 / 6")

Integrated 3-axis GALIL controller with sensor evaluation, error correction, and motion control

Options:

Alternative linear stages and rotary stages available
Configuration for cleanroom applications (up to ISO Class 6 or better)
Integration of additional sensors or camera systems
Custom software for user-specific alignment algorithms
Optional protective covers and vacuum components

Custom Extensions and Adaptations

The engineering services include customization for various wafer sizes, sensor types, and control systems. The system can be configured for cleanroom applications, alternative controllers, or specialized vacuum clamping fixtures.

Application Fields

Wafer and mask inspection, solar wafer inspection, laser structuring, microscopy, metrology, quality assurance, automated wafer alignment, semiconductor manufacturing

Specifications

782460:001.26		X	Y	Rz
Standard System		KT305-edlm	KT305-edlm	DE130-AC
Travel	[mm; deg]	170	170	n x 360
Repeatability unidirectional	[µm; deg]	± 0.4	± 0.4	0.005
Repeatability bidirectional	[µm; deg]	± 0.5	± 0.5	0.007
Positioning speed	[mm/s; deg/s]	50	50	180
Max. speed	[mm/s; deg/s]	100	100	360
Max. load	[N]		50	50
Dimensions (L × W × H)	[mm]	515 × 350 × 270
Max. sample size	[mm]	156 × 156 mm / 6" (M2)
Weight	[kg]	44
Motor		Dynamic Linear Motor (Ironless)	Dynamic Linear Motor (Ironless)	AC Servo (AC)
Drive				Harmonic Drive
Feedback		Linear Scale	Linear Scale	Motor Encoder
Measurement system resolution		0.1 µm, optional up to 0.001 µm or better
Optional features		Alternative linear and rotary stages available, configuration for cleanroom applications, integration of additional sensors or camera systems, customizable software for user-specific alignment algorithms, optional protective covers and vacuum components, adapter plate, chuck, base plate (granite / aluminum), frame, enclosure, customized vibration isolation using damping rubber layers or pneumatic dampers, safety concept and safety technology (emergency stop, door switches, light curtains, laser scanners, STO, SLS)
Cleanroom versions		up to cleanroom class ISO 6 (higher on request)
Beam variants		UV (DUV, EUV, X-ray, gamma on request)
Magnetism variants		magnetic