3-Axis EUV Mask Aligner for Laser Microstructuring
µm alignment for microstructuring under extreme conditions
This 3-axis mask system is specially developed for high-precision alignment of exposure masks for EUV lithography. This positioning system has three linear axes with parallel kinematic design: two in X and one in Y. The two vertical axes generate both vertical stroke (equal motion) and rotation (opposite motion). It thus enables high-precision linear and rotational positioning of masks in the nanometer range under ultraviolet radiation as well as in ultra-dry nitrogen atmospheres.
High-precision EUV wafer exposure
Integrated concept for coating and lubrication
These special environmental conditions require special materials and lubricants. For example, to minimize scattered radiation, all structural parts are provided with a special optimized coating that absorbs ultraviolet radiation. A highly specialized lubricant is also used that exhibits excellent chemical stability and an extremely low outgassing rate under ultraviolet radiation. It is also thermally stable, non-flammable and insoluble in water, acids, bases and most organic solvents.
Optimized maintenance concept
For maintenance, the system can be moved laterally out of the optical axis into service positions. If necessary, a magnetically preloaded quick-change mechanism ensures that the mask can be replaced quickly and easily in just a few steps. Maintenance of the motors and proximity switches, which are designed as interchangeable modules, is just as uncomplicated.
Individual extensions and customizations
Engineering services include the fitting of the systems to your structure and the desired controlls. Furthermore, we develop prototypes and like to adapt the systems to the environmental requirements of your application particle emission, radiation, temperature, precision special parts manufacturing, working height, collision protection, safety concept, compensation factor and filter, sensor mounting, brake, decoupling, special lubrication, special colors, holders, adapters, special motors with pharmaceutical approval, comprehensive documentation, test protocoll, llife cycle tests
Fields of application
High precision alignment of exposure masks in standard, electron beam and EUV lithography e.g. wafers, chips, die, pins, bonding, printed circuit boards, solar cells, solar panels, polarization sensitive photosensors as well as microstructuring
|Travel||[µm; deg]||150||50||± 1.5|
|[µm; deg]||± 1.5||± 2.5||± 0.03|
|[µm; deg]||± 2.5||± 3.5||± 0.05|
|Drive||Ball Screw||Ball Screw||Ball Screw|