Compact 3D mask aligner for SMT semiconductor printing / lithography | XY Phi positioning system (cleanroom, UV) for 650 x 650 mm / GEN 3
Handling and Production

782459:003.26.oem

Compact and precise aligner with high throughput

With this 225 mm flat aligner, two translative motions of 10 mm in X-Y and a phi rotation of 6° are realized. Three equal modules support the movable frame. The aligner is designed for loads up to 28 kg. Linear drives and increments in the sub-micrometer range ensure maximum throughput and stable printing processes in small dimensions.

Ideal for automated cleanroom production in UV radiation

Designed for dimensions up to max. 650 x 650 mm / GEN 3

Adjustment accuracy up to 0.4 µm / ± 0.0002° for loads up to 28 kg

Ultra flat design of 990 x 1090 x 225 mm

Reliable, maintenance-free and minimal emissions
(no friction, without moving cables / tubes)

Optional:

Adaptation to the process: aperture, sample holder, extension of the Z-axis, print head
Construction of the customer-specific end-to-end application as a stand-alone or flexible in-line concept
Integrated motion controller or PLC connection
Individual solution development with 3D design for the positioning task

Individual extensions and customizations

Engineering services include the fitting of the systems to your structure and the desired motion control or the completely individual solution development with 3D design for the application-specific positioning task.

Furthermore, we develop prototypes and like to adapt the systems to the environmental requirements of your application particle emission, radiation, temperature, precision special parts manufacturing, working height, collision protection, safety concept, compensation factor and filter, sensor mounting, brake, decoupling, special lubrication, special colors, holders, adapters, special motors with pharmaceutical approval, comprehensive documentation, test protocoll, llife cycle tests

Fields of application

Positioning of large substrates, masks, printing plates in a low-particle environment, semiconductor printers for applying coating components, UV printers, alignment of stencils, paste printing, automation of screen printing machines, stencil printers, electronics production

Specifications

782459:003.26.oem		X	Y	Rz
Travel	[mm; deg]	± 5	± 5	± 3
Repeatability unidirectional	[µm; deg]	± 0.4	± 0.4	± 0.0002
Repeatability bidirectional	[µm; deg]	± 0.7	± 0.6	± 0.0003
Positioning speed	[mm/s; deg/s]	50	50	10
Max. speed	[mm/s; deg/s]	100	100	20
Max. Load	[N]	275	275	275
Weight	[kg]	63
Length x width x height	[mm]	990 x 1090 x 225
Aperture		730 x 730
Aperture		650 x 650 / GEN 3
Guide		Air Bearing	Air Bearing	Air Bearing
Motor		Ironless Dynamic Linear Motor	Ironless Dynamic Linear Motor	Ironless Dynamic Linear Motor
Feedback		Linear Encoder	Linear Encoder	Linear Encoder
Material		Anodized Aluminum
Optional features		Extension Z-axis, sample holder, set-up as stand-alone or flexible in-line concept, safety concept and installation (emergency stop, door switch, safety light curtains, laser scanner, STO, SLS)
Variants clean room		up to clean room class ISO 5 (higher on request)
Variants beam		UV (DUV, EUV, X-ray, gamma on request)
Variants magnetism		magnetic