Mask Aligner for Laser Microstructuring786001:002.26
High-precision positioning in semiconductor technology
The mask system provides the fine adjustment and exact alignment of exposure masks in semiconductor lithography. The XY theta adjustment has three linear axes (two vertical and one horizontal) and has a parallel kinematic structure. The two vertical axes generate vertical stroke (same movement) as well as rotation (opposite movement). Parallel alignment of the three drives enables movement in three degrees of freedom; mechanical redundancy in determination is thus ruled out.
Special materials for use in demanding environments
The mask system was specially developed for use under ultraviolet radiation and in an ultra-dry nitrogen atmosphere. These specific environmental conditions require special materials and lubricants. Thus, to minimize stray radiation, all structural parts are coated with a Bilathal coating that absorbs ultraviolet radiation. It also uses a highly specialized lubricant based on perfluoropolyether. PFPE oil exhibits excellent chemical stability and extremely low outgassing even under ultraviolet radiation. It is also thermally stable, non-flammable and insoluble in water, acids, bases and most organic solvents.
Optimized maintenance concept
For maintenance, the system can be moved laterally out of the optical axis into service positions. A magnetically pre-stressed quick-change mechanism provides quick and easy replacement of the mask in just a few steps when necessary. Maintenance of the motors and initiators, which are designed as exchangeable modules, is just as uncomplicated.