XYZ positioning system for automated inline wafer inspection e.g. layer thickness measurement | travels in XY up to 650 mm, Z 100 mm
Automated XYZ inline wafer inspection with large sample capacity
This inspection system is specially designed for automated quality control of large and flat specimens up to 50 kg. The positioning system allows simultaneous positioning of sensor in Z and specimen in XY on a very compact footprint. The robust system also allows the use of heavy sensors or camera systems up to 20 kg in Z. The spindle drive, in combination with a spindle brake, guarantees optimum self-holding, so that a vertical position can be maintained in the de-energized state. The low-emission all-round enclosed system is also suitable for harsh industrial environments under dust and smoke. A suspension system has been attached to the granite for cable routing.
Compact design with optimized price/performance ratio
Individual extensions and customizations
Engineering services include the fitting of the systems to your structure and the desired controlls. Furthermore, we develop prototypes and like to adapt the systems to the environmental requirements of your application particle emission, radiation, temperature, precision special parts manufacturing, working height, collision protection, safety concept, compensation factor and filter, sensor mounting, brake, decoupling, special lubrication, special colors, holders, adapters, special motors with pharmaceutical approval, comprehensive documentation, test protocoll, llife cycle tests
Fields of application
Automated inline inspection and microscopy of large samples e.g. wafers, chips, die, pins, bonding, printed circuit boards, solar cells, solar panels, laser, layer thickness measurement, AOI, quality assurance in dusty fuming environments, surface inspection, investigation of deposits, scratches, surface irregularities.