Wafer inspection and metrology
For you we find customized solutions for non-contact optical inspection of wafers, probe cards, dies and microchip components. For this purpose, we offer systems for layer thickness measurement, contact inspection, electrical characterization, probe head positioning, sample manipulation and metrology of wafer microstructures in the nanometer range.
Configure the solution for your applications now
Inform us abour your exact requirements online, so that you can reach your targets as soon as possible.